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Terahertz Sensing and Imaging Technologies
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Terahertz Sensing and Imaging Technologies

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (30 July 2020) | Viewed by 2532

Special Issue Editor

Prof. Dr. Viktor Krozer

E-Mail Website
Guest Editor
Department of Physics, Goethe University of Frankfurt am Main, Max von Laue Strasse 1, 60438 Frankfurt, Germany
Interests: terahertz sensors; microwave sensors; bio-electromagnetic sensors; radar sensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Developments in the field of THz sensing and imaging have been boosted by the evolution of electronic and photonic technologies. In order to support the translation of terahertz technology from the laboratory to industry, I wish to showcase the already available sensing and imaging applications towards implementation of THz sensing and imaging systems. THz sensing and imaging have advanced in terms of performance, complexity, spectroscopy, resolution, and speed. This Special Issue will focus on these advances, especially considering industrial, biomedical and real-life applications. The Special Issue invites submissions in the areas of sensor and imaging devices, systems, and methodologies. Breakthrough approaches to terahertz sensing are particularly encouraged.

Prof. Dr. Viktor Krozer
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Terahertz sensor devices
  • Millimeter-wave and terahertz spectroscopy
  • THz industrial applications
  • THz imaging methods and algorithms
  • THz imaging devices
  • Millimeter-wave and terahertz broadband sensing
  • Industrial terahertz sensors and sensing systems
  • Biomedical terahertz sensors and sensing systems

Published Papers (1 paper)

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Research

14 pages, 5227 KiB  
Article
Design of a Multipurpose Photonic Chip Architecture for THz Dual-Comb Spectrometers
by Andrés Betancur-Pérez, Pedro Martín-Mateos, Cristina de Dios and Pablo Acedo
Sensors 2020, 20(21), 6089; https://0-doi-org.brum.beds.ac.uk/10.3390/s20216089 - 27 Oct 2020
Cited by 4 | Viewed by 2169
Abstract
In this work, we present a multipurpose photonic integrated circuit capable of generating multiheterodyne complex Dual-Combs (DC) THz signals. Our work focuses on translating the functionality of an electro-optic tunable DC system into a photonic chip employing standard building blocks to ensure the [...] Read more.
In this work, we present a multipurpose photonic integrated circuit capable of generating multiheterodyne complex Dual-Combs (DC) THz signals. Our work focuses on translating the functionality of an electro-optic tunable DC system into a photonic chip employing standard building blocks to ensure the scalability and cost efficiency of the integrated device. The architecture we analyze for integration is based on three stages: a seed comb, a mode selection stage and a DC stage. This final DC stage includes a frequency shifter, a key element to improve the final detection of the THz signals and obtain real-time operation. This investigation covers three key aspects: (1) a solution for comb line selection on GHz spaced combs using OIL or OPLL on photonic chips is studied and evaluated, (2) a simple and versatile scheme to produce a frequency shift using the double sideband suppressed carrier modulation technique and an asymmetric Mach Zehnder Interferometer to filter one of the sidebands is proposed, and (3) a multipurpose architecture that can offer a versatile effective device, moving from application-specific PICs to general-purpose PICs. Using the building blocks (BBs) available from an InP-based foundry, we obtained simulations that offer a high-quality Dual-Comb frequency shifted signal with a side mode suppression ratio around 21 dB, and 41 dB after photodetection with an intermediate frequency of 1 MHz. We tested our system to generate a Dual-Comb with 10 kHz of frequency spacing and an OOK modulation with 5 Gbps which can be down-converted to the THz range by a square law detector. It is also important to note that the presented architecture is multipurpose and can also be applied to THz communications. This design is a step to enable a commercial THz photonic chip for multiple applications such as THz spectroscopy, THz multispectral imaging and THz telecommunications and offers the possibility of being fabricated in a multi-project wafer. Full article
(This article belongs to the Special Issue Terahertz Sensing and Imaging Technologies)
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