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Advanced Mechanical Design and Applications of Metamaterials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Smart Materials".

Deadline for manuscript submissions: 20 June 2024 | Viewed by 222

Special Issue Editors


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Guest Editor
School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, China
Interests: microwave metamaterials; metastructure; artificial intelligence; acoustic metamaterials; 3D printing; broadband microwave absorber

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Guest Editor Assistant
Department of Mechanical Engineering, University of Hong Kong, Hong Kong
Interests: microwave metamaterials; metastructure

Special Issue Information

Dear Colleagues,

Metamaterials have drawn tremendous attention in both fundamental scientific research and advanced engineering applications in the last two decades. Metamaterials have introduced novel concepts and exciting functionalities that are beyond the traditional constraints imposed by natural materials, including negative refractive index media, microwave perfect absorber, invisibility cloaking, phase gradient metasurface, etc., some of which have already been realized and applied in practical applications. Nowadays, metamaterials have been employed at the interfacial and structural levels as well. Multi-physical properties like mechanical and dynamic responses have been considered in the design strategies of multifunctional metamaterials. For instance, sound attenuation, microwave absorber, and energy transduction require additional mechanical properties, such as being lightweight, load-bearing, as well as having environmental resistance.

This Special Issue mainly focuses on the latest design trends of multifunctional metamaterials with enhanced mechanical performances. We aim to highlight state-of-the-art theories, mechanisms, configurations, and fabrication techniques in this field.

Dr. Tao Wang
Guest Editor

Dr. Sichao Qu
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • multifunction
  • mechanical metamaterials
  • mechanical properties
  • loading support
  • broadband absorber
  • low-density material
  • 3D printing
  • energy absorption
  • sound absorption

Published Papers

This special issue is now open for submission.
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